Joining Alloy
Metallic mixtures used to create permanent electrical and mechanical connections are the foundation of all modern electronics. Manufacturers produce solder materials in various forms, including wire, paste and pre-formed shapes. These alloys must have a low melting point so they can be applied without damaging the sensitive components they are joining.
Conductive Performance
Electrical signals move through these joints, so the material must maintain high conductivity over the life of the device. Modern solder materials are mostly lead-free, using a combination of tin, silver and copper to meet environmental standards. The physical strength of the joint is just as important as its electrical properties, as it must withstand the vibrations and heat of daily use.
Failure of a single joint can cause an entire machine to stop working.
Application Method
Automated machines apply the alloy to circuit boards using techniques like wave soldering or reflow. In this process, the solder materials are heated until they flow into the joints and then cooled rapidly to form a solid bond. Precise control of the temperature is necessary to ensure the metal wets the surface correctly without creating bridges between separate circuits.
Quality is checked using x-ray and optical inspection tools.